Over the last thirty years, the processor on a desktop PC using socket packaging in the form of a separate chip mounted on the motherboard. In this way, the PC processor can be updated (upgrade) provided it has the same socket type and supported by the motherboard in question.
On the Intel platform, from the first generation Core i processors use socket type LGA (land grid array) with a pin count of 775 pieces to 2011 pieces of the latest high-end processor.
However, a leaked roadmap published by Japanese site PCWatch revealed that in the future there is the possibility of PC processors will no longer come in packs socket, but is soldered directly to the motherboard.
(Image: pc.watch.impress.co.jp)
Packaging is using the contact mechanism Ball Grid Array (BGA) in which the legs of the chip connected directly to the PCB board, similar to the chip GPU graphics card on the PC and chip RAM modules.
In this way, the size of the form factor PC can be minimized. The price paid is not a CPU upgrade option for the corresponding chip permanently embedded on the motherboard.
Through the upgrade, a user can build the system gradually by purchasing inexpensive processors first, such as the Core i3-3220 (3.3 GHz), and then switch to a faster processor like the Core i7-3770K (3.5 GHz, quad-core ) if any funds.
This is not possible if future computer switch to using BGA packaging.
As is known, the recent desktop PC sales decline while mobile devices continues to grow. Intel processor as the largest PC manufacturers were taking steps to anticipate and move towards embedded platforms such as requiring low power usage.
If later became reality, as shown in the pictures roadmap, BGA packaging looks in line with the vision of Intel's x86 architecture to encourage her toward more efficient power consumption.
In the opposite camp with Intel, there are no signs that AMD will take similar steps, and even then if Intel's roadmap image does represent the truth.
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